2020年05月28日

Using lithography to create integrated circuits

Adaptable hybrid electrics: how versatile built-in circuits unlock their probable



Adaptive Hybrid Electronics (FHE) claims to mix the operation of ordinary rigid electronic devices with the adaptability of printed electronic devices.


An interim technique is usually to solder a standard packaged rigid IC to the (usually stiffened) flexible substrate. Such circuits are typically referred to as versatile printed circuits (FPCBs) in spite of possessing etched interconnects. Sadly, mounting a packaged IC substantially impedes versatility and eliminates the potential of R2R production.


L298N is an integrated monlithic circuit in a 15-lead Multiwatt and PowerSO20 packages. It is a high voltage, high current dual full-bridge driver designed to accept standard TTL logic levels and drive inductive loads such as relays, solenoids, DC and stepping motors.


One remedy will be to use bare dies, a method which has been used for a long time in RFID tags. These have a incredibly smaller IC hooked up at two details utilizing a conductive adhesive to an antenna. Nonetheless, this application avoids two on the problems related with introducing larger, far more capable ICs. For starters, the ICs are so modest that their overall flexibility is almost irrelevant at any sensible bending radius. Secondly, large attachment pads are viable considering that only two digital connections are required.


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Nevertheless, since the ICs turn out to be a lot more able (such as the ones that integrate Bluetooth or memory) and therefore bigger, issues start to come up. Firstly, their lack of adaptability gets a difficulty for FHE purposes considering that they can't conform into the fundamental substrate.


related articles:

How to release the multi-function built-in circuit


Packaged ICs: A temporary Answer


Flexible hybrid electronics


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